Asahi Kasei has launched its new TA Series of Sunfort™ dry film photoresist, targeting the expanding market for advanced semiconductor packaging, particularly in artificial intelligence (AI) servers. This product is part of the company’s strategic initiative within its Material sector, aimed at bolstering its presence in next-generation chip packaging.

The TA Series is designed to meet the increasing technical demands of back-end semiconductor processing. It offers ultra-high resolution with both conventional stepper exposure systems and laser direct imaging (LDI) systems, which are used to transfer circuit patterns onto substrates. These capabilities enhance the performance and precision of back-end processes, contributing to more efficient and cost-effective manufacturing.

Sunfort™ dry film photoresist is a core component of Asahi Kasei’s Electronics business, which includes electronic materials and components. This business has been designated a "First Priority" segment in the company’s medium-term management plan, “Trailblaze Together,” which spans fiscal years 2025 through 2027.

Advanced semiconductor packaging frequently employs interposers, which connect chips and substrates. These interposers require large-area, multilayer structures and high-density wiring technologies. Traditionally, liquid photoresists have been preferred for forming redistribution layers (RDL) due to their high resolution. However, dry film photoresists offer several benefits—particularly for panel-level packaging—such as easier handling and the ability to process both sides of a substrate.

Historically, dry films were limited in resolution, restricting their use in RDL formation. The TA Series overcomes these limitations by leveraging Asahi Kasei’s expertise in photosensitive materials and new material designs. The film enables fine wiring in panel-level packages, achieving resist widths of 1.0 µm using LDI exposure in 4 µm pitch designs.

Using a semi-additive process (SAP), the TA Series supports the formation of 3 µm-wide plating patterns in a 4 µm pitch. This innovation allows for finer wiring and greater production efficiency, which helps reduce manufacturing costs and increase yield—key advantages for producers of advanced semiconductor packages.

“Asahi Kasei’s development of the TA Series is the result of extensive collaboration with customers and a deep understanding of their evolving needs,” said Yu Hasegawa, managing executive and senior general manager of the Electronics Interconnecting Materials Division. “As demand grows in sectors such as AI, automotive, and the Internet of Things, particularly in Asia and North America, we are strengthening our global support systems to provide timely, localized solutions.”

The TA Series underscores Asahi Kasei’s commitment to innovation and its strategic focus on high-growth markets.