DIC to build new epoxy resins facility in Chiba, boosting semiconductor supply; receives ¥3 billion subsidy from Japanese government.
DIC Corporation has taken a significant strategic step to strengthen its presence in the rapidly growing field of advanced electronics by deciding to build a new epoxy resins production facility at its Chiba Plant in Ichihara, Chiba Prefecture. This move aligns with the company’s long-term vision of providing innovative solutions within the domain of "chemitronics"—a field DIC defines as the fusion of chemistry and electronics, particularly focused on materials essential for semiconductor packaging and high-performance electronic components. The expansion is driven by increasing global demand for semiconductors and advanced electronic applications, which are critical to supporting high-speed, high-capacity communication technologies.
The decision to invest in this new facility comes after the Japanese Ministry of Economy, Trade and Industry (METI) approved DIC’s plan as part of a national initiative under the Act on the Promotion of Ensuring National Security through Integrated Implementation of Economic Measures. With this recognition, the project is eligible for a substantial government subsidy of up to ¥3 billion, reinforcing the strategic importance of this expansion in supporting national economic and security goals.
Epoxy resins, which are thermosetting synthetic materials known for their outstanding moldability, heat resistance, electrical insulation, and adhesive properties, play a vital role across multiple industries. DIC began its journey with epoxy resins back in 1968 and has since developed a robust product portfolio catering especially to the electronics sector. The company has built a strong reputation by offering cutting-edge materials through its comprehensive polymer design capabilities—from raw material development to large-scale manufacturing. These resins are essential in semiconductor production, offering enhanced heat resistance, dimensional stability, and lower transmission loss—key features that support next-generation communication systems.
Currently, DIC’s existing production capacity at the Chiba Plant is insufficient to meet the projected surge in demand. To address this gap and secure long-term supply stability, the company has resolved to construct an additional facility adjacent to the current one. The new facility is expected to boost the annual production capacity of epoxy resins used in semiconductor applications by 59%. DIC also plans to implement advanced production technologies at the new facility, aiming for world-class quality and greater operational efficiency, which will further enhance its competitive edge in the global market.
The new facility is scheduled to commence operations in July 2029. By expanding its manufacturing capacity and adopting innovative production methods, DIC intends to reinforce its contribution to a stable semiconductor supply chain in Japan and support ongoing advancements in the electronics industry.
