Dow’s new DOWSIL™ EG-4175 Silicone Gel enhances IGBT module reliability with high-temperature resistance, self-healing, adhesion, and efficiency for EVs, renewables.
Dow has introduced its latest innovation, DOWSIL™ EG-4175 Silicone Gel, designed to provide advanced protection for next-generation insulated gate bipolar transistor (IGBT) modules operating at elevated voltages. This breakthrough material is engineered to withstand the extreme demands of modern power electronics, particularly those used in electric vehicles (EVs), photovoltaic (PV) systems, and wind turbines.
The new silicone gel demonstrates excellent resistance to temperatures up to 180°C, which is crucial for devices exposed to higher thermal stress. Beyond temperature resilience, the material offers vibration absorption and self-healing capabilities, allowing it to repair minor cracks automatically without external assistance. It also incorporates self-priming adhesion, enabling stronger module protection, and cures effectively at room temperature. For faster manufacturing processes, the gel can also cure under heat to shorten production cycle times.
According to Cathy Chu, Global Strategic Marketing Director, Consumer & Electronics, Dow, the company is enhancing its IGBT materials portfolio to address the growing demand for higher power density systems. She emphasized that the superior high-temperature resistance of DOWSIL™ EG-4175 Silicone Gel compared to traditional materials will enable manufacturers to design more efficient IGBT modules. Chu added that this innovation highlights Dow’s ongoing commitment to supporting the advancement of the EV and renewable energy sectors, both of which play critical roles in reducing global carbon emissions.
This launch aligns with emerging trends in power electronics. In EVs, for instance, battery systems are transitioning from 400V to 800V architectures, enabling faster charging and improved inverter efficiency. In renewable energy, inverter power densities in PV panels and wind turbines are steadily rising, allowing greater efficiency and increased electrical load management. The 7th generation of IGBT technology brings higher junction temperatures and greater loads, requiring encapsulant solutions with exceptional dielectric strength and thermal resistance — qualities well addressed by DOWSIL™ EG-4175 Silicone Gel.
Dow’s broader portfolio of silicone-based dielectric gels already provides crucial benefits such as thermal resistance, insulation, encapsulation, mechanical stability, and environmental protection. Building on this foundation, the new gel adds further advantages, including reduced silicone oil bleed and enhanced adhesion without the need for primers. Unlike conventional encapsulants, gels cure into a uniquely soft material that still retains the dimensional stability of an elastomer, making them particularly effective in stress relief and long-term protection of sensitive electronic components.
DOWSIL™ EG-4175 Silicone Gel also complements another Dow innovation, DOWSIL™ EA-7158 Adhesive, a one-part, solvent-free, high-strength silicone adhesive that provides strong, primerless adhesion to a wide range of substrates. This adhesive cures rapidly under heat, offers translucency for inspection, and delivers long-term reliability in demanding applications.
Both DOWSIL™ EG-4175 Silicone Gel and DOWSIL™ EA-7158 Adhesive are available worldwide, strengthening Dow’s role as a comprehensive solutions provider for IGBT modules and supporting the transition toward a cleaner, more sustainable energy future.
