izmomicro’s silicon photonics packaging breakthrough sets global benchmarks, strengthens India’s semiconductor leadership, and drives future AI, cloud, and telecom infrastructure.
izmomicro, a dedicated division of izmo Ltd., has announced a landmark achievement in the field of silicon photonics packaging, reinforcing India’s growing leadership in advanced semiconductor integration. This breakthrough not only highlights the company’s pioneering efforts in the nation’s semiconductor ecosystem but also elevates India’s standing in the global competition to build next-generation data and artificial intelligence (AI) infrastructure.
At the core of this achievement is izmomicro’s newly developed high-density silicon photonics packaging platform, which supports a remarkable 32-channel fiber input and output. Even more impressive is the platform’s ability to maintain an industry-leading insertion loss of less than 2 dB. Attaining such density and performance is considered one of the most demanding challenges in photonics, requiring nanometer-scale optical alignment, advanced assembly techniques, and precise integration of photonics with electronics. The module is further enhanced with 32 DC input/outputs, 4 RF input/outputs, and high-speed RF performance up to 70 GHz, establishing a new standard for packaging that merges optical and electronic capabilities seamlessly.
This accomplishment is the result of years of dedicated research and continuous investment in cutting-edge semiconductor packaging technologies by izmomicro. By addressing density and precision challenges that have long constrained silicon photonics, the company has solved a critical industry bottleneck. As a result, izmomicro now joins an elite group of global companies capable of delivering such advanced packaging solutions.
The significance of this innovation extends far beyond technical achievement. High-density, ultra-low-loss silicon photonics packaging is a cornerstone technology enabling the future of AI, cloud computing, and telecommunications. Traditional copper interconnects are rapidly nearing their physical limitations, making silicon photonics the preferred path for delivering multi-terabit optical communication. With this breakthrough, izmomicro has unlocked new levels of scalability and energy efficiency that are vital for hyperscale data centers, AI superclusters, and the rollout of 5G and upcoming 6G networks.
Reflecting on this milestone, Dinanath Soni, Executive Director of izmomicro, remarked, “Achieving this fiber density with ultra-low insertion loss is a defining moment for us. Only a few companies worldwide have demonstrated such capabilities, and we are proud to be the first in India. This achievement validates our years of research in precision packaging and firmly positions us as a trusted global partner for silicon photonics innovation. As AI and data-driven technologies continue to evolve, our innovation will be central to powering the infrastructure of the future.”
The timing of this achievement is particularly relevant as the global silicon photonics market is poised for rapid expansion. Valued at USD 2.65 billion in 2025, the sector is projected to surpass USD 9 billion by 2030, growing at a compound annual growth rate of over 25%. The surge is largely fueled by the demand for faster, more efficient data transmission to support cloud computing, AI, and modern telecommunications. With its breakthrough, izmomicro is strategically positioned to play a pivotal role in shaping this transformation and ensuring India’s prominence in the global semiconductor landscape.
