Tecnoflon® is their range of market-first non-fluorosurfactant perfluoroelastomers.
Syensqo has unveiled a significant breakthrough in high-performance sealing materials with the launch of its Tecnoflon® NFS FFKM portfolio.
Engineered to meet the semiconductor industry’s rising demands for purity, durability, and sustainability, the new grades represent a major advancement in next-generation polymer science.
In this interview, we speak with Andrew Lau, Senior Executive VP Electronics & Industrial at Syensqo Specialty Polymers, to discuss the strategic drivers, technological innovations, and broader industry implications behind this pioneering FFKM platform—and what it means for the future of semiconductor and industrial manufacturing.
1. Could you give us an overview of this product and what the new grades represent?
The new Tecnoflon® NFS FFKM portfolio is the market-first non-fluorosurfactant perfluoroelastomers to meet the market’s demands for performance and sustainability. These grades are specially engineered to expand Syensqo’s successful FFKM offerings for semiconductor manufacturing and other highly demanding markets.
The new grades include nitrile curable, peroxide curable and high-temperature
grades for semiconductor applications, which mark a major milestone for both Syensqo and the broader advanced materials industry. It is a clear demonstration of Syensqo’s commitment to leading the industry with greater sustainability—delivering high-performance solutions that not only meet the most demanding technical requirements but also support a more resilient supply chain for the semiconductor industry and beyond.
2. What strategic factors and market dynamics motivated Syensqo to develop the industry’s first high-temperature Non-Fluorosurfactant (NFS) perfluoroelastomer (FFKM) grades?
The development was driven by increasing regulatory pressure to eliminate fluorosurfactants, rising demand for higher purity in semiconductor and industrial processes, and the need for materials that withstand harsher operating environments. Syensqo’s proactive approach addresses customer needs for more sustainable sealing solutions with higher performance and the commitment for a more resilient supply chain.
3. The new Tecnoflon® NFS FFKM materials represent a major leap in elastomer technology. Could you elaborate on the technological principles and R&D milestones that enabled this breakthrough in high-temperature performance?
The breakthrough was enabled by proprietary polymerization and curing technologies that achieve high molecular weight and crosslink density without fluorosurfactants. Key R&D milestones included the development of novel NFS polymerization processes, advanced curative systems, and rigorous validation in real-world semiconductor manufacturing environments.
4. How does the introduction of these high-temperature NFS FFKM grades align with Syensqo’s broader sustainability strategy and its commitment to enabling safer, more environmentally responsible polymer solutions?
The launch of Tecnoflon® FFKM NFS marks a major milestone for both Syensqo and the broader advanced materials industry. It is a clear demonstration of Syensqo’s commitment to leading the industry with sustainable innovation—delivering high-performance solutions that not only meet the most demanding technical requirements but also support a cleaner, safer future for the semiconductor industry and beyond.
Our journey began in 2013, phasing out first-generation fluorinated surfactants. By 2022, we eliminated nearly 100% of fluorosurfactant emissions at Spinetta. In 2024, we transitioned FKM formulations to non-fluorosurfactant technology. This year, we launched the first Tecnoflon® PFR FFKM NFS portfolio, which delivers top performance without the use of any surfactants at all in the manufacturing process. Each step improves supply chain security and reduces environmental impact.
5. Sealing material quality directly affects equipment reliability and process stability. What specific mechanisms in the new NFS FFKM grades enhance thermal endurance, chemical resistance, and sealing integrity in extreme industrial and semiconductor environments?
Seals close to the wafer must resist degradation under intense heat and plasma exposure or they could become a source of particle contamination. Plasma and high temperature resistant resins are critical for maximizing uptime and maintaining high yields. For our plasma resistant NFS polymer, we re-engineered the polymer backbone for improved mechanical properties, chemical and plasma resistance. Because common curatives can be used with this nitrile resin, it is also easily integrated into standard O-ring formulations. This means better seal durability and less particle shedding, even without using added filler.
6. You’ve mentioned that the new NFS FFKM materials can operate continuously at up to 320°C, surpassing conventional grades. Could you elaborate on how this improvement translates into real-world performance and longer maintenance cycles for end users?
In addition to re-engineering the polymer backbone, we’re also working on new curative technologies which enable excellent performance in environments beyond the capabilities of typical FFKM materials.
Our NFS curatives enable continuous use at 320°C, no added fillers needed. The unfilled formulation achieves top temperature and performance,10–15°C higher resistance than leading o-ring formulations.
Operating continuously at up to 320°C, these materials extend seal life, reduce failure rates, and lengthen maintenance intervals. For end users, this translates into higher equipment uptime, lower total cost of ownership, and improved process stability.
7. From a manufacturing perspective, how does the new curative technology and Non-Fluorosurfactant chemistry integrate into existing production or molding lines without requiring additional capital investment?
The new curative technology and NFS chemistry are designed for drop-in compatibility with existing molding and production lines. No additional capital investment is required, simplifying adoption and minimizing operational disruption.
8. Syensqo is among the first in the world to offer high-purity, high-temperature, fluorosurfactant-free FFKM materials. How significant is this achievement from a regulatory compliance, environmental, and competitive standpoint?
Being among the first to offer high-purity, high-temperature-resistant, non-fluorosurfactant FFKM materials positions Syensqo as a leader in regulatory compliance and environmental stewardship. This innovation provides a competitive edge and supports customers in meeting evolving global regulations in the semiconductor sector.
9. What are some of the industries where your product can be used?
Applications include semiconductors, high-end transportation, energy, industrial and any industry requiring high-purity, chemically resistant, high-temperature sealing solutions.
10. Beyond semiconductors, do you foresee adoption in other industries such as energy, aerospace, or chemical processing that also demand extreme heat and purity?
Yes, these materials are well-suited for energy, aerospace, and industrial applications, where extreme heat, aggressive chemicals, and purity are critical.
11. The launch also includes nitrile and peroxide curable grades—could you explain how each variant caters to different customer needs or process environments?
Our NFS portfolio meets diverse semiconductor process needs. It includes:
• Nitrile grades for dry processes were the first grades we developed and are available now. They are known for low outgassing, and good mechanical properties under moderately high temp & mild plasma exposure.
• Nitrile grades for plasma processes are also available. They help to increase seal life under a variety of plasma types while maintaining an ultra-low particle environment.
• Peroxide grades for wet process and high temperature processes are at pre-production stage
12. How do you foresee this new generation of high-temperature FFKM materials influencing supply chain sustainability and the broader semiconductor and industrial sealing ecosystem over the next five years?
FFKM is essential for semiconductor O-rings. Syensqo’s market-first NFS FFKM technologies are an important step in improving the resiliency of the o-ring supply chain for the semiconductor industry.The portfolio aligns with industry roadmaps for dry and wet processes.We focus on circular feedstocks and end-of-life strategies. We are Innovation- and future-focused, enabling superior O-ring performance.
13. As electronics, energy, and process industries demand higher thermal and chemical resistance, how is Syensqo positioning its FFKM innovations to serve next-generation applications and manufacturing environments?
Syensqo is investing in continuous innovation, collaborating with industry leaders, and leveraging its expertise to deliver FFKM solutions that meet the evolving demands of electronics, energy, and process industries.
14. What have been the key challenges in transitioning from conventional FFKMs to Non-Fluorosurfactant-based systems—both technically and in terms of customer validation—and how has Syensqo addressed them?
Syensqo is building a brand new portfolio of customized solutions that can achieve equivalent or superior performance without the use of fluorosurfactants. The portfolio prioritizes addressing the most urgent needs of the semiconductor industry including high temperature, plasma resistance and low temperature needs. Syensqo has been able to address the successful adoption of challenges through intensive R&D experiences, close customer collaboration, and comprehensive field testing.
15. Given the increasing emphasis on environmental compliance and sustainability reporting, how does Syensqo leverage data, analytics, and lifecycle assessments to quantify and communicate the environmental impact of its new NFS FFKM materials?
Syensqo uses advanced analytics and lifecycle assessments to quantify the environmental impact of its NFS FFKM materials, supporting transparent sustainability reporting and helping customers meet their compliance goals.
16. Is Syensqo leveraging digital tools, advanced analytics, or market intelligence to enhance process optimization, monitor emerging trends in semiconductor and industrial manufacturing, and maximize the performance and market impact of innovations like the NFS FFKM portfolio across global operations?
The company leverages digital platforms, advanced analytics, and market intelligence to optimize processes, monitor industry trends, and maximize the performance and market impact of its NFS FFKM portfolio globally.
